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Impact of N_2O/NH_3/N_2 Gas Mixture on the Interface Quality of Germanium MOS Capacitors

机译:N_2O / NH_3 / N_2气体混合物对锗MOS电容器界面质量的影响

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摘要

In this paper, nitration of germanium surface using a mixture of N_2O, NH_3 and N_2 is performed using RF-PECVD reactor. The electrical characteristics of Al/HfO_2/GeON/p-Ge capacitors are investigated. Results show that the hysteresis of metal-oxide-semiconductor (MOS) capacitors with nitration-based passivation step is reduced to ~150 mV, compared with ~400mV of the untreated sample. The suppression of hysteresis is attributed to the reduction of electron traps and enhancement of dielectric/Ge interface quality. The improved interface quality of plasma-based nitration of Ge surface is a promising technique for high performance Ge MOSFET fabrication.
机译:在本文中,使用RF-PECVD反应器进行使用N_2O,NH_3和N_2的混合物的锗表面的硝化。研究了AL / HFO_2 / GEON / P-GE电容器的电气特性。结果表明,与〜400mV的未处理样品相比,基于硝化的钝化步骤的金属氧化物半导体(MOS)电容器的滞后降至约150mV。滞后的抑制归因于减少电子疏水阀和电介质/ GE接口质量的增强。基于等离子体的GE表面硝化的改进界面质量是高性能GE MOSFET制造的有希望的技术。

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