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4H-SiC V-Groove Trench MOSFETs with Low Specific On-State Resistance and High Reliability

机译:4H-SIC V沟槽沟MOSFET具有低特定的导通电阻和高可靠性

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The originally structured 4H-SiC V-groove trench MOSFET with {0-33-8} face for the trench sidewalls has been proposed. The inclined trench structure can be fabricated by the thermochemical chlorine etching, resulting in the smooth low damage surface. Consequently, the low specific on-state resistance of the VMOSFET was attained. Thus a large current of 150A was obtained with a single 6-mm-square chip. High Temperature Gate Bias (HTGB) test was performed under a gate bias of +20V or -10V at 175°C. After 2500 hour test, the threshold voltage kept stable only within ±0.2 V voltage shifts. Due to these advantages, the VMOSFETs are suitable for use in automotive electronic devices and the regenerative energy generation system applications.
机译:已经提出了最初结构化的4H-SiC V沟槽MOSFET,具有云侧壁的{0-33-8}面。倾斜沟槽结构可以通过热化学氯蚀刻制造,从而产生平滑的低损伤表面。因此,达到了VMOSFET的低特异性导通抗性。因此,用单个6mm-Square芯片获得的大电流150A。在175℃下在+ 20V或-10V的栅极偏压下进行高温栅极偏压(HTGB)测试。 2500小时后,阈值电压仅在±0.2 V电压偏移范围内保持稳定。由于这些优点,VMOSFET适用于汽车电子设备和再生能源产生系统应用。

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