Orientation-dependent mechanical behaviour of electrodeposited copper with nanoscale twins

摘要

The electrodeposition of copper is an important technology for the fabrication of micro-components and interconnects. In contrast to nanocrystalline copper, nanotwinned Cu (nt-Cu) exhibits remarkable strength, ductility and electrical conductivity. Our recent work reported the possibility to deposit copper samples with highly-oriented nanoscale twins by pulse electrodeposition. The twin orientation was altered from horizontal to vertical by changing the applied potential and the twin spacing was controlled with pulse-off time.