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Electrodeposited copper oxide films: Effect of bath pH on grain orientation and orientation-dependent interfacial behavior

机译:电沉积氧化铜膜:镀液pH值对晶粒取向和取向相关界面行为的影响

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摘要

Copper (I) oxide (Cu_2O) films were cathodically electrodeposited on Sn-doped indium oxide substrates. The influence of electrodeposition bath pH on grain orientation and crystallite shape was carefully re-examined using X-ray diffraction and scanning electron microscopy. In addition to the (100) and (111) preferred orientations identified in two previous sets of studies, as the bath pH was varied in the present study from~7.5 to ~12, a third preferred orientation, (110), was identified in a narrow pH range, ~9.4 to ~9.9. A remarkable shift in the flat-band potential (spanning ~500 mV) was measured in a non-aqueous electrolyte medium for the various Cu_2O samples obtained from baths of varying pH.
机译:氧化铜(I)(Cu_2O)膜被阴极电沉积在掺Sn的氧化铟衬底上。使用X射线衍射和扫描电子显微镜仔细检查了电沉积浴pH对晶粒取向和微晶形状的影响。除了在先前的两套研究中确定的(100)和(111)首选方向外,由于本研究中浴液的pH从7.5改变到〜12,pH值的第三种首选方向(110)得以确定。 pH范围很窄,约9.4至9.9。在非水电解质介质中,对于从不同pH值的镀液中获得的各种Cu_2O样品,在平带电位上都有明显的变化(跨度为〜500 mV)。

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