Thin film silicon solar module encapsulation technology research

摘要

The encapsulation failure is a serious problem which leads to power degradation and life time reduction of silicon based thin film solar module. Therefore, the encapsulation material and related technology research and development become more and more important. This article describes some different junction box and middle foil encapsulation technology of the silicon based thin film solar module, different encapsulation materials and processes are compared and their impact on the manufacturing cost and module performance are discussed. The aim of this study is to find an appropriate solution of module encapsulation failure.