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Molecular Dynamics Simulation on the Influence of Quartz Substrate Temperature on Low Energy Argon Ion Bombardment Model in Dry Etching Process

机译:分子动力学模拟在干蚀刻过程中石英底物温度对低能氩离子轰击模型的影响

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We investigated the effect of temperature on the physical sputtering of an a-quartz substrate by low energy Argon ion method using molecular dynamics simulation. The Second Generation Charge-Optimized Many Body (COMB10) potential developed by Shan et al was chosen to model the interatomic potential of quartz substrate and Lennard-Jones potential was used to model the surface interaction between Ar ions and quartz substrate. The incident ion energies, E_i were set at 50eV, l00eV and 150eV and substrate temperature were set at 300K and 800K. Simulations results show that the temperatures significantly affected the sputtering yield at higher energised Ar ions. For instance, the sputtering yield at l00eV show a significant increase as we varied the temperature as compared to the sputtering yield at 50eV.
机译:通过使用分子动力学模拟,我们通过低能量氩离子法研究了温度对A-石英底物物理溅射的影响。第二代电荷优化的许多机构(COMM10)由Shan等人开发的潜力被选择为模拟石英基板的内部电位,并且Lennard-Jones电位用于模拟Ar离子和石英底物之间的表面相互作用。入射离子能量,E_I设定为50EV,L00EV和150EV和衬底温度设定为300k和800k。仿真结果表明,温度显着影响较高通电的AR离子的溅射产率。例如,与50eV的溅射产率相比,L00EV的溅射产量显示出显着的增加,与50EV的溅射产率相比。

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