Integrated Method for Multi-Scale/Multi-Modal Investigation of Micro-Mechanical Wood-Adhesive Interaction

摘要

The principal role of adhesive bonds is to facilitate transfer of loads between adherents. The way stress is transferred through the bond interphase is important for many critical mechanical properties of wood-based composites. In this project we combine state-of-the-art imaging tools with morphology-based numerical modeling methods for an integrated, multi-modal and multi-scale characterization of stress transfer across adhesive bonds. The numerical model designed to simulate the micro-mechanical behavior of wood-adhesive interphase is informed by empirical studies on 3D cell-level morphological structure and adhesive penetration in small samples, and by full-field displacement and strain maps measured on the same samples in course of nondestructive shear and compressive tests. In this paper we present the conceptual framework of the project and data flow between the experimental study and the model. This project is part of ongoing research supported by the National Science Foundation Industry/University Cooperation Research Center for Wood-Based Composites.