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Influence of the circumferential speed of a resin bond grinding wheel on the properties of a ground aspheric surface

机译:树脂粘合轮圆周速度对地面非球面性能的影响

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In recent times, resin bond grinding wheels have often been used for the precise grinding of aspheric surfaces. In this paper, the influence of changes in the circumferential speed of the resin bond grinding wheel on the microroughness of the produced surface and also on the volume of the structures and the scratches is presented. The article also discusses how the cutting wear of the tool affects the surface quality and shows the correlation between the circumferential speed and the rate of degradation of the resin bond grinding wheel. A circumferential speed interval from 12 m/s to 24 m/s was investigated and the effect of tool degradation was observed at 1.9-hour intervals. The results of the experiment show that the optimal circumferential speed of the tool lies around 20 m/s. At this speed, the tool produces a perfectly polishable surface and tool degradation is minimized.
机译:最近,树脂粘合轮通常用于非球面的精确研磨。本文介绍了树脂键砂轮的圆周速度变化对所产生表面的微小的影响以及结构的体积和划痕。本文还讨论了工具的切割磨损如何影响表面质量,并显示圆周速度与树脂粘合砂轮的劣化速率之间的相关性。研究了从12m / s至24m / s的圆周速度间隔,并且在1.9小时间隔观察到刀劣化的效果。实验结果表明,该工具的最佳圆周速度约为20米/秒。在此速度下,该工具产生完全抛光的表面,刀具劣化最小化。

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