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Structural and optical properties of 200 mm germanium-on-insulator (GeOI) substrates for silicon photonics applications

机译:用于硅光子应用的200mM锗 - 绝缘体(GeoI)基板的结构和光学性能

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Integrated laser sources compatible with microelectronics represent currently one of the main challenges for silicon photonics. Using the Smart Cut? technology, we have fabricated for the first time 200 mm optical Germanium-On-Insulator (GeOI) substrates which consist of a thick layer of germanium (typically greater than 500 nm) on top of a thick buried oxide layer (around 1 μm). From this, we fabricated suspended microbridges with efficient Bragg mirror cavities. The high crystalline quality of the Ge layer should help to avoid mechanical failure when fabricating suspended membranes with amounts of tensile strain high enough to transform Ge into a direct bandgap material. Optical GeOI process feasibility has successfully been demonstrated, opening the way to wafer-scale fabrication of new light emitting devices based on highly-tensely strained (thanks to suspended membranes) and/or doped germanium.
机译:与微电子兼容的集成激光源代表目前硅光子学的主要挑战之一。使用智能切割?技术,我们已经制造了第一次200mM光学锗 - 绝缘体(GeoI)基材,其在厚的掩埋氧化物层(约1μm)的顶部上由厚的锗(通常大于500nm)组成。由此,我们用高效的布拉格镜腔制造了悬浮的微生物。 GE层的高晶体质量应该有助于避免在用足够高的拉伸应变的悬浮膜制造悬浮膜时避免机械故障,以将GE转化为直接带隙材料。光学地质工艺可行性已成功地证明,基于高度紧张(由于悬浮的膜)和/或掺杂锗,对新的发光器件的晶片规模制造的方式开放方式。

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