CarrICool - the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase

摘要

This paper presents specific solutions dedicated for HPC computer systems to extend critical capabilities of integrated circuits performance by application of the innovative interposer module with special attention paying on signal integrity issues. Research efforts [2][4] performed by European FP7 project CarrICool [1] consortium are focused on several fields like Integrated Circuits (IC) cooling efficiency improvement to reach the level of 600W/cm~2 by development of embedded microfluidic structures. Optical communication by dedicated IC interconnects, optimized power delivery by distributed buck converters and electrical communication up to 10GHz assured by optimized 3D interconnecting structures are also in scope of CarrICool R&D activities.