Numerical Simulation of Rapid Solidification Process for Micrometer Level Solder Ball Used in BGA Packaging

机译：BGA包装中使用千分尺焊球快速凝固过程的数值模拟

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We numerically simulated the containerless rapid solidification for micrometer level solder ball used in BGA packaging, based on prior models for heterogeneous droplet nucleation and non-equilibrium solidification, to predict the solidification microstructure of solder ball. Results of simulations for Sn-5mass%Pb solder ball produced under different conditions are discussed.

机译：基于现有模型的非均相液滴成核和非平衡凝固，在数值上模拟了BGA包装中使用的千分比水平焊球的容器快速凝固。预测焊球的凝固微观结构。讨论了在不同条件下生产的Sn-5mass％PB焊球的模拟结果。

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《International Conference on Electronic Engineering and Information Science》|2014年||共4页
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Shu Li; Jianwei Huang; Fei Wang;
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中图分类 TB3-532;
关键词
Ball grid array; Solder ball; Microelectronic packaging; Microstructure; Simulation; Sn-5massPb;

机译：球栅阵列;焊球;微电子包装;微观结构;模拟;SN-5MAS％PB;

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专利

1. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA)ASSEMBLY--PART Ⅱ: RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION [J] . 史训清, John HL Pang, 杨前进, 力学学报：英文版 . 2002,第004期

机译：球栅阵列（BGA）组装中焊点可靠性的快速评估方法-第二部分：可靠性实验与数值模拟
2. Reaction Kinetics of Solder-Balls with Pads in BGA Packages during Reflow Soldering [J] . HO C.E., CHEN Y.M., KAO C.R. Journal of Electronic Materials . 1999,第11期

机译：BGA封装中的锡球与焊盘的回流焊动力学
3. Reaction Kinetics of Solder-Balls with Pads in BGA Packages during Reflow Soldering [J] . C.E. HO, Y.M. CHEN, C.R. KAO Journal of Electronic Materials . 1999,第11期

机译：BGA封装中的锡球与焊盘的回流焊动力学
4. Numerical Simulation of Rapid Solidification Process for Micrometer Level Solder Ball Used in BGA Packaging [C] . Shu Li, Jianwei Huang, Fei Wang International Conference on Electronic Engineering and Information Science . 2014

机译：BGA包装中使用千分尺焊球快速凝固过程的数值模拟
5. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003

机译：用共晶铅锡和无铅焊料对塑料球栅阵列，芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
6. Cold Expansion Process with Multiple Balls—Numerical Simulation and Comparison with Single Ball and Tapered Mandrels [O] . David Curto-Cárdenas, Jose Calaf-Chica, Pedro Miguel Bravo Díez, 2020

机译：具有多个球数模拟的冷膨胀过程和单球和锥形心轴的比较
7. Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging [O] . Chun-Sean Lau, Mohd Zulkifly Abdullah 2013

机译：仿真研究对板级BGA包装回流焊接过程中的流体/结构相互作用

Numerical Simulation of Rapid Solidification Process for Micrometer Level Solder Ball Used in BGA Packaging

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