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Preparation and characterization of Cu:Co3O4/Si heterojunction prepared by spray pyrolysis

机译:喷雾热解制备Cu:Co3O4 / Si异质结的制备及表征

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Undoped and Cu doped cobalt oxide thin films with (x= 1, 3, 5, 7, and 9)% were prepared by spray pyrolysis at substrate temperature (350)癈. Structural and optoelectronic properties of thin films were studied by X-ray diffraction XRD, Atomic Force Microscope AFM, current- voltage (I-V) and capacitance- voltage (C-V) measurement. X-ray diffraction results revealed that all films consist of single C03O4 phase with preferred orientation (111) and cubic spinel structure. AFM micrographs indicated that the grain size decrease with increasing Cu doping. Current transport properties of the p-Cu:Co3O4/n-Si heterojunctions are investigated by current-voltage measurements in dark and illumination with different incident power. The ideality factor were found to be strongly depending on Cu doping, there is an increase in the ideality factor with increasing Cu doping. In part of C-V measurements, built-in potential value were found to decrease with increasing of Cu. The higher spectral responsivity of the junction was 54 A/W at (600-700) nm wavelength for copper ratio 9%.
机译:未掺杂的和Cu掺杂的氧化钴薄膜与(X = 1,3,5,7和9)%是由在衬底温度(350)喷雾热解制备癈。结构和薄膜的光电特性,用X射线衍射XRD,原子力显微镜AFM,电流 - 电压(I-V)和电容 - 电压(C-V)测量了研究。 X射线衍射结果表明,所有的膜由具有优选取向(111)和立方尖晶石结构的单相Co 3 O 4的。 AFM显微照片表明,晶粒尺寸减小随着铜掺杂。的电流传输特性的p的Cu:四氧化三钴/正硅异质结是通过在黑暗和光照具有不同入射功率的电流 - 电压测量的影响。理想因子被发现强烈依赖于铜掺杂,有随着铜掺杂的增加,理想因子。在C-V测量的一部分,内置潜在价值发现与铜的增加降低。结的较高频谱响应为54 / W在(600-700)nm波长处对铜比9%。

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