THE ROAD TO WAFER-ON-WAFER (WOW) HIGH VOLUME MANUFACTURING (HVM)-ADVANCED SENSING IN WAFER HANDLING

摘要

3D integration of functions such as sensors enables miniaturized and cost-effective smart systems. This paper reviews how the sensors consequently enable smart volume manufacturing of 3D IC such as Wafer-On-Wafer (WOW), where process wafers can be fragile and difficult to transfer safely. Multi-disciplinary sensing technology will be introduced for wafer handling and in-line inspection before or during the wafer's process steps.