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MATERIAL SELECTION AND ITS IMPACT ON COPLANARITY OF SPRING PIN PROBE HEADS

机译:材料选择及其对弹簧探针头共面的影响

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Spring probe (pin) is becoming one of the major contactor technologies in WLCSP probe head testing due to its increased compliance versus traditional contactors. The pin to pin coplanarity of a spring pin probe head is determined by various factors and housing material is one of the primary factors. This paper introduces the results of a study conducted at Smiths Connectors (IDI) on spring pin probe head housing materials. The compression spring of a spring pin is preloaded when mounted on a test board. This preload force pushes the probe head housing up and causes its bowing. The quantity of spring pins, housing structure, and housing material are major factors to influence the bowing. To select an optimal material, extensive finite element analysis (FEA) were performed to simulate the probe head housing deformation under external preload. Typically probe heads have a large quantity of cavity holes for spring pins, which can affect FEA accuracy. A specific methodology is applied and the measurement results indicate FEA can accurately predict housing bowing. The FEA results indicate that a thermoplastic composite material with a higher flexural modulus of elasticity has less bowing and lower contactor tip coplanarity. Another character of thermoplastic composite materials, water absorption, can significantly affect contactor cavity true position and probe head performance. When selecting higher flexural modulus material, lower water absorption must be considered as well.
机译:由于其遵守与传统接触器的顺从,弹簧探针(PIN)正在成为WLCSP探头测试头测试中的主要接触器技术之一。弹簧销探针头的销钉与弹簧探针头的共面积由各种因素和壳体材料确定是主要因素之一。本文介绍了在弹簧尖头探头壳体材料上在史密斯连接器(IDI)上进行的研究的结果。安装在测试板上时,弹簧引脚的压缩弹簧被预加载。这种预紧力推动探头盖板并导致其弯曲。弹簧销,壳体结构和外壳材料的数量是影响弯曲的主要因素。为了选择最佳材料,进行广泛的有限元分析(FEA)以在外部预载荷下模拟探头壳体变形。通常,探头头具有大量的弹簧引脚腔孔,这会影响FEA精度。应用特定方法,测量结果表明FEA可以准确地预测壳体弯曲。 FEA结果表明具有较高弯曲弹性模量的热塑性复合材料具有较少的弯曲和下接触器尖端共面。另一种特征的热塑性复合材料,吸水性,可显着影响接触器腔真实位置和探头性能。 When selecting higher flexural modulus material, lower water absorption must be considered as well.

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