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Roll-to-roll atmospheric pressure plasma CVD of SiO2 moisture barrier films 3.05

机译:SiO2水分阻隔膜的辊卷大气压等离子体CVD 3.05

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Atmospheric pressure plasma enhanced chemical vapor deposition (AP-PECVD) is a new and rapidly evolving technology having clear benefits in terms of equipment costs, footprint size and possibilities for in-line processing. The excellent scalability of the dielectric barrier discharge combined with the possibility to generate non-thermal plasma in low-cost helium free gas mixtures, are essential requirements for large scale processing of functional films on web-rolled substrates. These functional films can be applied as gas barrier films for advanced packaging applications such as medical applications, thin film photovoltaics and flexible OLED encapsulation. The super-linear scaling of the barrier films with the thickness and power per deposited precursor molecule paves the road for high performance barrier foils.
机译:大气压等离子体增强化学气相沉积(AP-PECVD)是一种新的和快速发展的技术,在设备成本,占地面积和在线加工的可能性方面具有明显的益处。介电阻挡排出的优异可扩展性与在低成本氦气混合物中产生非热等离子体的可能性,这是对卷绕基板上功能膜的大规模加工的必要要求。这些功能膜可以应用于用于高级包装应用的阻气膜,例如医疗应用,薄膜光伏和柔性OLED封装。每个沉积的前体分子厚度和功率的阻挡膜的超线性缩放铺设了高性能屏障箔的道路。

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