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Improved Bonding for SMC Body Panels Using Plasma Laboratory to Production - (PPT)

机译：使用等离子体实验室生产 - （PPT）改进了SMC体面板的粘合 - （PPT）

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Plasma Bonding Provides More Consistent Fiber Tear and Reduces Bonding Variability vs. The Current Sanding Process. Plasma Dosage Speed/Distance Must Not Exceed 75mm/sec at a Distance of 6mm from the Part. (If Higher Dosage Speeds are Used, Random Bond Failures May Occur). Production at Ford Chicago Assembly Plant has been on-going since November, 2013.

机译：等离子体粘合提供更一致的纤维撕裂并减少粘接变异性与当前的打磨过程。等离子体剂量/距离不得超过75mm / sec，距离部分6mm。（如果使用较高的剂量速度，则可能发生随机键失度）。福特芝加哥集会工厂的生产已自2013年11月以来一直持续。

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《Society of Manufacturing Engineers Composites Manufacturing Conference and Exposition 》|2014年||共30页
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Dan Houston;
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Improved Bonding for SMC Body Panels Using Plasma Laboratory to Production - (PPT)

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