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Ⅲ-Ⅴ Compound Semiconductor Field Effect Transistors for Low Power Digital Logic

机译:Ⅲ-ⅴ低功率数字逻辑化合物半导体场效应晶体管

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As traditional Silicon transistor scaling fast approaches its limits alternate channel materials are being actively researched to enable a new era of power constrained Very Large Scale Integrated (VLSI) circuit design. The outstanding transport properties of compound semiconductor Ⅲ-Ⅴ materials make them very attractive candidates to continue scaling into deep sub-micron technology nodes beyond 14nm. However several key challenges need to be addressed in order for these new materials to replace state of the art Strained Silicon, High-k metal gate or Silicon on Insulator (SOI) technologies. This paper discusses the key issues involved and recent research highlights in Ⅲ-Ⅴ MOSFETs motivating their viability for future low power CMOS technology.
机译:随着传统的硅晶体管缩放快速接近其限制,正在积极研究替代信道材料,以实现新的功率时代受限的非常大规模集成(VLSI)电路设计。化合物半导体Ⅲ-ⅴ材料的出色运输特性使其非常有吸引力的候选人,以继续缩放到14nm之外的深层微米技术节点。然而,需要解决几个关键挑战,以便为这些新材料替代艺术紧张硅,高k金属栅极或硅的绝缘体(SOI)技术。本文讨论了涉及的关键问题和Ⅲ-ⅴMOSFET中最近的研究亮点激励了他们对未来低功率CMOS技术的可行性。

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