Evaluating the Optimal Thermocouple Attach Method and the Optimal Thermocouple Location for Area Array Package Profiling (PPT)

摘要

TC attach on the Bottom of the PCB below the BGA provided more consistency irrespective of the BGA size and PCB thickness. When considering all zones, there was a 2 to 3 degree temperature differential between the bottom of the PCB and the flat TC soldered under the BGA.