THERMOCOUPLE ARRANGEMENT ON PRINTED CIRCUIT SUPPORT, PROCESS FOR MAKING SAME, METHOD FOR OPERATING SAME, THERMOCOUPLE HAVING SUCH ARRANGEMENT, AND METHOD FOR MANUFACTURING THERMOCOUPLE, FOR TRAINING OF PERSONNEL AND EVALUATION OF AUTOMATIC MACHINES

摘要

P On a support 1 for printed circuits which could be composed of several laminated layers, are deposited on one side a layer 3 of a first conductive material, for example copper, and on the opposite side a second layer 5 of material conductive, for example constantan, at least one of these two layers having a configuration of a circuit with holes passing through the support 1 and in which is laid a layer of the first conductive material connecting the latter to the second material conductive to give rise to thermocouple junctions 9 which can be connected to voltmeters V1 and making it possible to monitor the rise in temperature, for example during soldering using a soldering iron T, a wire connection 13a of an electronic component 13, hence the possibility of training personnel and evaluating the aptitude of automatic welding machines without overheating of the support 1 or of the component 13. /P