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Photo-Electrochemical Etching in the Process of Direct H2 Generation by Illumination of GaN-Based Material Structures Immersed in Water

机译:通过浸入水中的GaN基材料结构的照射直接H2生成的光电化学蚀刻

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Hydrogen is considered a promising candidate for energy storage. We investigated the cleanest way for hydrogen production by direct photo electrolysis of water with GaN/AlGaN based p-n structures used as working electrodes. Besides the H_2 production rate, an important consideration is the material etching (corrosion) that accompanies the photo-electrochemical process. The GaN-based structures were grown on sapphire substrates by the chloride hydride vapor phase epitaxy and used as a photo anode immersed into an aqueous electrolyte. For a p-n GaN/AlGaN structure we observed a H_2 production rate of 0.6 mL/cm~2×h. Corrosion of the electrode proceeds in two steps. First, there is a near vertical etching process, which is associated with defects in the material and penetrates deep into the structure. Subsequently, the process involves etching of n-type layers in lateral direction resulting in the formation of voids and cavities. The lateral etching is due to net positive charges arising from the spontaneous and piezoelectric polarization in the structure and positively charged ionized donors in the space charge region of the p-n junction.
机译:氢被认为是能量储存的有希望的候选者。我们调查了通过用作工作电极的GaN / AlGaN的P-N结构直接照片电解的最干净的氢生产方法。除了H_2生产率外,重要的考虑因素是伴随光电化学过程的材料蚀刻(腐蚀)。通过氯化物氢化物气相外延在蓝宝石基材上生长GaN的结构,并用作浸入水性电解质中的光阳极。对于P-N GaN / AlGaN结构,我们观察到0.6ml / cm〜2×h的H_2生产率。电极的腐蚀分两步进行。首先,存在近垂直蚀刻工艺,其与材料中的缺陷相关联,并且深入地穿进结构中。随后,该过程涉及在横向方向上蚀刻n型层,从而产生空隙和空腔。横向蚀刻是由于结构中的自发和压电偏振产生的净正电荷,并且在P-n结的空间电荷区域中具有带正电的电离供体。

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