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ATMOSPHERIC PLASMA TREATMENT PRIOR TO SELECTIVE CONFORMAL COATING

机译:选择性保形涂层之前的大气等离子体处理

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One of the most common causes of defects in the conformal coating process is contamination of the printed circuit assembly resulting in bubbles, dewetting or delamination of the cured coating material. The image below (Figure 1) illustrates this contamination related defect. Plasma Treatment removes contaminants and increases surface energy, thus offering a potential solution to these common failures. Plasma Treatment is a form of surface modification. It is used in the pretreatment of material surfaces prior to gluing, bonding, painting, dispensing, or coating and can be used on virtually any material surface including those of textiles, metals, plastics, glass, etc. Plasma is generated by combining a gas with an increased amount of energy where the gas becomes electronically There are two common forms of plasma treatment Low Pressure Plasma (Vacuum Plasma) and Atmospheric Plasma that are used for surface modifications of substrates. Vacuum Plasma is created using a vacuum pump in which most of the air is removed from a sealed chamber. With enough air removed, the chamber low-pressure reaches adequate levels for ionizing the remaining air or gases with a strong electrical field producing plasma. All surfaces of a material are treated at the same time using Vacuum Plasma. Atmospheric Plasma on the other hand requires no closed chamber, it is produced by electrically energizing air or gases as they pass through a nozzle at surrounding atmosphere or normal pressure using a pulsed electric arc generated by high voltage discharge. The effects of plasma treatment are short lived, typically allowing less than one hour to apply coatings or adhesives. Atmospheric Plasma Treatment allows for in-line processing, eliminating the time constraint and the need for labor intensive, batch processing. The purpose of this study is to confirm the feasibility of inline, atmospheric plasma treatment prior to automated, selective conformal coating of printed circuit boards.
机译:保形涂覆过程中最常见的缺陷原因之一是印刷电路组件的污染,导致固化涂料的气泡,脱水或分层。下面的图像(图1)说明了这种相关的缺陷。等离子体处理除去污染物并增加表面能,从而为这些常见故障提供潜在的解决方案。等离子体处理是一种表面改性的形式。它用于在胶合,粘接,涂漆,分配或涂覆之前的材料表面的预处理,并且可以在几乎任何材料表面上使用,包括纺织品,金属,塑料,玻璃等等离子体产生等离子体具有增加的能量,其中气体以电子方式变为有两种常见的等离子体处理低压等离子体(真空等离子体)和大气等离子体,用于表面修饰的基板。使用真空泵产生真空等离子体,其中大部分空气从密封室移除。除了足够的空气中,腔室低压达到足够的水平,用于电离剩余的空气或气体,具有强大的电场产生等离子体。使用真空等离子体同时处理材料的所有表面。另一方面,大气等离子体不需要闭合腔室,它是通过在通过高压放电产生的脉冲电弧处穿过周围大气或常压时的喷嘴而产生的空气或气体产生的。等离子体处理的效果短寿命,通常允许涂层或粘合剂的少于1小时。大气等离子体处理允许在线加工,消除时间限制和劳动密集型,批量处理的需求。本研究的目的是确认在自动化电路板自动化,选择性保密涂层之前inline,大气等离子体处理的可行性。

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