X-RAY INSPECTION TECHNOLOGY - AN APPLICATION DRIVEN APPROACH

摘要

The use of X-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, X-ray system manufacturers developed solutions that address the unique BGA inspection requirements. X-Ray inspection quickly became an integral part of the quality assurance function of modern electronic manufacturers when placing and reworking BGA components. However, as new X-ray technologies are introduced - from new algorithms to new hardware - users are faced with a growing range of options to choose from. Users need a solid technical background to understand the various options to make an educated decision when acquiring X-ray inspection capabilities. For example, what level of resolution is necessary for a specific application? Is an open tube or sealed source the most appropriate technology to deploy? Unfortunately, X-ray companies are not always clear about the pros and cons of each option. As a result, users end up buying too much or too little capability. In either situation, the user is left without the right X-ray inspection solution.