A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications

摘要

The field of power electronics packaging presents intricate and interdisciplinary challenges. System costs, reliability and performance are strongly determined by various aspects such as mechanical design, materials, thermal management and interconnect technologies. The overall costs of the product depend mainly on the complete process chain in the module development. Automation as well plays an important role and facilitates higher production rates, efficient use of materials, better product quality, and reduced factory lead times. This paper focuses on emerging interconnection technologies of bonding semiconductor components to power electronic substrates like diffusion soldering, conductive adhesive bonding and reactive multi-layer bonding. An overview on the automation potentials and complexities in individual technologies for the manufacturing of reliable and cost-effective power modules is given and discussed. Thus, a basis is created for choosing optimal die-attach technology depending on economic and technologic demand by comparing the state-of-the-art and advanced technologies.