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Influence of Sm_2O_3 Additive on BaO-Al_2O_3-B_2O_3-SiO_2 Glass-Ceramics for CBGA Package

机译:SM_2O_3添加剂对CBGA封装的BaO-Al_2O_3-B_2O_3-SiO_2玻璃陶瓷的影响

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Sm_2O_3 additive significantly influenced the microstructure, mechanical, and electrical properties of BaO-Al_2O_3-B_2O_3-SiO_2 glass-ceramics. The calculation by the whole pattern fitting method based on XRD patterns revealed that Sm_2O_3 additive improved the crystallization process of this tetra-system and promoted the formation of major phase quartz. The sintering kinetics showed that Sm_2O_3 addition markedly reduced the sintering activation energy from 406.86 kJ/mol to 391.38 kJ/mol, which benefited the sintering densification and the grain growth, and thus enhanced mechanical properties. Doping 2% Sm_2O_3 reinforced the flexure strength from 136.3 to 171.6 MPa and the Young's modulus from 49.4 to 79.7 GPa. It also exhibited low dielectric constant of 5.31, low dielectric loss of 5.30× 10~(-4), and high thermal expansion coefficient of 11.76 × 10~(-6)/°C.
机译:SM_2O_3添加剂显着影响了BaO-Al_2O_3-B_2O_3-SiO_2玻璃陶瓷的微观结构,机械和电性能。基于XRD图谱的整体拟合方法计算显示SM_2O_3添加剂改善了该Tetra-系统的结晶过程并促进了主要相石英的形成。烧结动力学表明,SM_2O_3添加显着降低了406.86 kJ / mol至391.38 kJ / mol的烧结活化能,这使得烧结致密化和晶粒生长,从而提高了机械性能。掺杂2%SM_2O_3从49.4至79.7GPa加强了136.3至171.6MPa和杨氏模量的弯曲强度。它还表现出低介电常数为5.31,低介电损耗为5.30×10〜(-4),高热膨胀系数为11.76×10〜( - 6)/°C。

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