The Thermal Expansion Behaviors of Cu-SiCp Composites

摘要

The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiC_p) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiC_p reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiC_p were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiC_p composites were found significantly lower than those of the non-Coated Cu-SiC_p composites. The CTEs of the Cu-Coated Cu-SiC_p composites were in agreement with Kernel's model which accounts for both the shear and isostatic stresses developed in the component phases.