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Fabrication and thermal physical properties of SiC_p/Al composite upon powder metallurgy followed by hot extrusion

机译:粉末冶金后SiC_P / Al复合材料的制备和热物理性质,然后是热挤压

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In this study, SiC particles reinforced aluminum matrix composite was successfully fabricated using powder metallurgy technique followed by hot extrusion. The phases were identified by XRD and the microstructures were observed by SEM. The results showed that only Al and SiC phases existed in the composite, SiC particulates were well distributed in the aluminum matrix and the interface between Al and SiC was clean and well combined. Meanwhile, thermal conductivity and coefficient of thermal expansion of the composite were investigated, the research showed that thermal conductivity decreased as SiC_p content increased because of poor thermal conductivity of SiC_p and increased crystal defects forming during the fabrication process. And the same to thermal conductivity, coefficient of thermal expansion of the composite decreased as SiC_p content increased because SiC_p can acted as obstacles to the motion of dislocations, which can hinder the hot movement of electronics.
机译:在该研究中,使用粉末冶金技术成功制造了SiC颗粒增强铝基质复合材料,然后用热挤出成功制造。通过XRD鉴定各相,通过SEM观察微观结构。结果表明,在复合材料中只有Al和SiC相,SiC颗粒在铝基中分布得很好,Al和SiC之间的界面清洁且合并良好。同时,研究了复合材料的导热系数和热膨胀系数,研究表明,由于SIC_P的导热性差和在制造过程中形成增加的晶体缺陷,随着SIC_P含量增加,导热率降低。与热导率相同,随着SIC_P含量增加,复合材料的热膨胀系数降低,因为SIC_P可以充当脱位运动的障碍,这可能阻碍电子器件的热运动。

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