Thermal analysis study on packaging materials of Power-LED

摘要

In this paper, a high power- LED package model has been built. Different bonding materials and substrate materials have been chosen. Having performed simulations of the temperature field by ANSYS finite element software, the conclusions are drawn as follows: nanometer silver paste has the best heat transfer characteristics; ALN is an ideal substrate material because of its lowest junction temperature, thermal resistance and the maximum heat load when the junction temperature reaches 120°C.