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Laser Nucleation and Solid Phase Crystallization of a-Si:H

机译:A-Si的激光成核和固相结晶:H.

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The ability to grow large-area, large-grained polycrystalline silicon on inexpensive substrates is becoming increasingly important for photovoltaic (PV) devices. With large-grained (grain size >10 μm) 10 μm thick films it is possible with light trapping to achieve PV efficiencies exceeding 15%. If crystallites could be nucleated and grown for longer times before native nucleation occurs, then potentially these much larger grain, thin film silicon material could be produced. The interaction of sub-crystallization threshold laser fluence with hydrogenated amorphous silicon (a-Si:H) has been demonstrated on a macroscopic scale to shorten the incubation time in subsequently thermally annealed films. Further examination of crystallite laser nucleation, found that nucleation was suppressed around PECVD a-Si:H thin film(50-100nm) sample edges, and scratches, in addition to laser-ablated areas, extending as much as 100-200 μm laterally from these features. Optical microscopy and stepwise high temperature thermal annealing were used to investigate this behavior for the a-Si:H films deposited on glass substrates. The nucleation rates were measured in the treated and untreated regions. The data suggests that these features (edges, scratches, and laser ablated areas) provide stress relief by interrupting the surface connectivity. We confirm the existence of stress and stress relief by μ-Raman measurements of the crystallite transverse optical peak position relative to that of c-Si. PECVD films were annealed at temperatures between 540-600C, to enable a determination of r_n at each anneal temperature. The temperature dependent measurements enabled the determination of the nucleation rate activation energies (E_A), and how they are affected by film stress.
机译:在廉价的基材上生长大面积大的多晶硅硅的能力对于光伏(PV)器件变得越来越重要。用大粒度(粒度> 10微米)10微米厚的膜有可能用的光捕获,以实现PV效率超过15%。如果发生在原生成核发生前的微晶且生长的时间较长,则可能产生这些更大的粒子,薄膜硅材料。子结晶阈激光能量密度与氢化非晶硅的相互作用(的a-Si:H)已被证明在宏观尺度上,以缩短在随后进行热退火的膜的温育时间。进一步检查微晶激光成核的检查,发现核心在PECVD A-Si:H薄膜(50-100nm)样品边缘周围抑制,除了激光烧蚀区域之外,划痕除了横向延伸多达100-200μm这些功能。光学显微镜和逐步高温热退火用于研究沉积在玻璃基板上的A-Si:H膜的这种行为。在处理和未处理的区域中测量成核率。数据表明,这些特征(边缘,划痕和激光烧蚀区域)通过中断表面连接来提供应力浮雕。我们通过相对于C-Si的微晶横向光学峰值位置的μ-拉曼测量来确认存在应力和应力消除。 PECVD薄膜在540-600℃的温度下退火,以在每个退火温度下测定R_N。温度依赖性测量使得能够确定成核速率激活能量(E_A),以及它们如何受胶片应力的影响。

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