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Ni-based ohmic contacts to silicon carbide examined by electron microscopy

机译:基于Ni的欧姆触点到电子显微镜检查的碳化硅

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Ni/Si multilayer contact structures to 4H-SiC after subsequent annealing steps were investigated with electron microscopy methods. After high temperature annealing step, specific defects in the contact structures were observed. The influence of phase transformations during annealings on the morphology of the contacts was discussed and the explanation of formation mechanism of voids within the contact layer was proposed.
机译:通过电子显微镜方法研究了后续退火步骤后Ni / Si多层接触结构至4H-SiC。在高温退火步骤之后,观察到接触结构中的特异性缺陷。讨论了退火期间相变期间的影响,并提出了接触层内空隙的形成机制的解释。

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