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Microstructure and Thermoelectric Properties of Bulk and Porous N-type Silicon-Germanium Alloy Prepared by HUP

机译:HUP制备的散装和多孔N型硅锗合金的微结构和热电性能

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The optimization of powders preparation and consolidation process leads to the achievement of a high thermoelectric figure of merit (ZT=1.25 at 800°C) in an n-type silicon-germanium (SiGe) alloy hot pressed at low heating rate. It has been experimentally observed that HUP compacting conditions can preserve nanostructuring. We also investigated the effect of porosity on the thermoelectric properties. Porous samples have enhanced Seebeck coefficients and low thermal conductivity. However, the figure of merit of the bulk specimen remains better than the porous samples due to a significant degradation of electrical conductivity. Working on grain boundaries engineering to enhance charge carriers mobility seems to be a promising way in addition to limiting nanograin growth with a densification process control.
机译:粉末制备和固结过程的优化导致在低加热速率下压榨机中的N型硅锗(SiGe)合金中的高温(Zt = 1.25在800℃下)的高热电图。它已经通过实验观察到HUP压实条件可以保持纳米结构。我们还研究了孔隙率对热电性能的影响。多孔样品具有增强的塞贝克系数和低导热率。然而,由于电导率显着降解,散装样品的优异图仍然优于多孔样品。除了利用致密化过程控制的纳米疱疹增长,除了粮食边界工程,似乎是一种有希望的方式。

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