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Fabrication of Large Sintered Pellets of Sb-doped N-type Mg_2Si Using a Plasma Activated Sintering Method

机译:使用等离子体活性烧结法制备Sb掺杂N型Mg_2S的大烧结粒料

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Sb is known to be the most stable n-type dopant in Mg_2Si, whereas the reproducibility and sintering scalabity of Sb-doped Mg_2Si has proved to be difficult. We have developed a metallic binder for the Sb-doped Mg_2Si sintering process. A remarkable benefit of the binder is that it enables us to reproducibly fabricate large sintered Sb-doped Mg_2Si pellets up to 30 mm in diameter with no internal cracks. For binder contents of 3 to 7 wt%, the observed power factor and thermal conductivity were identical to that of conventional Sb-doped samples, while excess binder degraded the TE properties. The binder mixture also plays a part in increasing the yield in the production of TE legs, up to 82% for 5 wt% Ni incorporation, as well as improving the hardness of the sintered sample. Incorporation of 5 wt% Ni binder affected an increase in the ZT value up to 0.97.
机译:已知Sb是Mg_2SI中最稳定的n型掺杂剂,而SB掺杂Mg_2Si的再现性和烧结速度已经证明是困难的。我们开发了一种用于SB掺杂Mg_2SI烧结过程的金属粘合剂。粘合剂的显着益处是,它使我们能够可重复地制造直径为30mm的大型烧结的SB掺杂Mg_2SI颗粒,而没有内裂缝。对于3至7wt%的粘合剂含量,观察到的功率因数和导热率与常规的Sb掺杂样品相同,而过量的粘合剂降解了TE性能。粘合剂混合物还发挥了提高TE腿部生产的产量的一部分,5wt%Ni掺入的82%,以及改善烧结样品的硬度。掺入5wt%的Ni粘合剂影响ZT值的增加,高达0.97。

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