Research of Reliable Design of Printed Circuit Board Suited for Smart Grid

摘要

Electric utilities faced with the prospect of increasing customer rates are seeking solutions to challenges presented by rising global energy demand, aging infrastructure, increasing fuel costs and renewable portfolio standards in light of climate change. Many consider Smart Grid to be one such solution. The most two significant characteristics of Smart Grid are self-healing ability and high reliability. As the bottom stage of development of Smart Grid communication system, the signal quality and self reliability of PCB design directly influence the entire performance of the communication system. This article focuses on analyzing reliable PCB design suited for Smart Grid communication system from power supply, thermal dispersion and trace routing.