Thick Film Solutions to HOT Problems in Electronics

摘要

Thick printing Ag- and Cu-Pastes meet the targets for power application: (1) Thick printing Ag-paste suitable for Al_2O_3- substrates (2) Thick printing Cu-pastes suitable for Al_2O_3- and AlN - substrates (3) Fired film thickness 300~+ μm for power tracks (4) Fired film thickness ～ 30 μm for logic tracks (5) Good solder adhesion (6) Good bond adhesion with 300 μm Al-thick wire: 1. 100% wire-brake high values for shear adhesion initial 2. 100% wire-brake and high values for shear adhesion after 1000 cycles (-40/+150°C) (7) Cu-pastes suitable for ENIG and ENIPIG plating (8) Stencil printing decreases the number of layers.