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Optimization Study on Preparation of Macroporous Silicon on P-type Silicon Substrate by Electrochemical Etching

机译:电化学蚀刻对P型硅衬底上大孔硅的制备优化研究

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Low cost electrochemical etching method was utilized to prepare macroporous silicon on p-type silicon substrate in dilute HF solution. By optimizing the substrate resistivity, the etching current density, and the etching time, excellent macroporous silicon was obtained on 15 ?·cm p-type silicon substrate with the pore diameter of about 2 ?m, the pore depth of about 30 ?m, and the surface pore density up to ~10 /cm~2. Such macroporous silicon gave out an excellent antireflective performance with the reflectance lower than 4% in a wide spectral range of 400-1000 nm. The low reflectance combined with the deep pore morphology provides an attractive potential to fabricate radial p-n junction solar cells on such macroporous silicon.
机译:利用低成本电化学蚀刻方法在稀释的HF溶液中在p型硅衬底上制备大孔硅。通过优化基板电阻率,蚀刻电流密度和蚀刻时间,在15Ω·cm p型硅衬底上获得优异的大孔硅,其孔径为约2Ωm,孔深度为约30Ωm,表面孔密度高达约10 / cm〜2。这种大孔硅在400-1000nm的宽光谱范围内具有低于4%的反射率优异的抗反射性能。与深孔形态结合的低反射率为在这种大孔硅上制造径向P-N结太阳能电池提供了有吸引力的潜力。

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