High Thermal Dissipation Apparatus for UV LEDs Application

摘要

In this study, composite electroplating technique is used to fabricate the diamond-added copper heat spreader for UV LED applications Thermal dissipation characteristic and optical performance are improved as the composite diamond-added copper heat spreader adoption The low thermal resistance of 18.4 K/W with UV LED using diamond-added copper heat spreader was measured Surface temperature of UV LED using the diamond-added copper heat spreader is 50.42 °C at 500 mA injecting current lower than pure copper heat spreader of 59.9°C and original heat spreader of 90.4°C. The thermal diffusivity of the diamond-added copper is 0.7179 cm~2/s measurement by laser flash method Output power and power efficiency of UV LEDs are also enhanced to 71.81 mW and 4.32%, respectively, at 400 mA injection current The optimal structure design and materials fabrication will be discussed.