Multi-layer circuitry carrier used for high-current applications, has heat dissipation apparatus which is provided with electrically conductive heat sinks that are thermally coupled with inner metal layer through recess

摘要

The carrier (10a,10b) has a surface (12a,12b) that is provided for mounting a component (20), and an inner metal layer (14a,14b). A heat dissipation apparatus (30a,30b) is provided with a recess (32) in the circuit substrate and an electrically conductive heat sink (34a,34b). The heat sinks are thermally coupled with the inner metal layer through the recess. The heat sink is connected to a cooling unit (36). The heat sink is provided with a cavity filled with cooling liquid. The electrically conductive heat sink forms an electrical connection to a ground.