Preparation and Properties of Silicon-containing Arylacetylene Resins with Octa(maleimidopheny!)silsesquioxane

摘要

Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)-silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N_2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.