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Effect of Ti Element on the Mechanical Properties of Cu-matrix Bonding Diamond Tool Bits

机译:Ti元件对Cu矩阵粘接金刚石刀头的力学性能的影响

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Using the hot-pressing sintering method, Cu-matrix bonding diamond tool bits including 0, 4 and 8 % Ti content (wt.%) were prepared. The effect of Ti content on the mechanical properties of Cu-matrix bonding diamond tool bits was studied. The experimental results showed that the influence of Ti content on the flexural strengths of Cu-matrix bonding bits and diamond tool bits are significant. Furthermore, the morphologies and compositions of fracture surfaces of diamond tool bits were characterized by scanning electron microscope and energy dispersive spectroscopy. The results illustrated that when the Ti content was 4%, the interface bonding between the diamond and the Cu-matrix bonding was the strongest, the flexural strength had the maximum values of the Cu-matrix bonding bits and the diamond tool bits, the values were 644 MPa and 515.8 MPa respectively.
机译:使用热压烧结方法,制备包括0,4和8%Ti含量(WT.%)的Cu族基质粘合金刚石刀具。研究了Ti含量对Cu族基质粘接金刚石刀头的力学性能的影响。实验结果表明,Ti含量对Cu - 基质粘接比特和金刚石刀头的弯曲强度的影响很大。此外,通过扫描电子显微镜和能量分散光谱表征金刚石刀具比特的断裂表面的形态和组成。结果表明,当Ti含量为4%时,金刚石和Cu - 基质键合之间的界面键合最强,弯曲强度具有Cu - 矩阵粘接位和金刚石刀具位的最大值,值分别为644 MPa和515.8MPa。

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