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Numerical Simulation of Embedded and Co-cured Composite Damping Structure under Low Velocity Impact

机译:低速冲击下嵌入和共固化复合阻尼结构的数值模拟

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Embedded and co-cured composite damping structure is a novel damping processing structure, which possesses excellent damping properties and mechanical performances. In this paper, explicit dynamic analysis software LS-DYNA is employed to simulate low velocity impact on embedded co-cured composite damping structure panels. To illustrate the validity of modeling and calculation method, the simulation results are compared with the experimental data. And the results show that the impact resistance of embedded co-cured composite damping structure is much better than composite panel without damping material.
机译:嵌入式和共固化的复合材料阻尼结构是一种新型阻尼加工结构,具有出色的阻尼性能和机械性能。在本文中,采用显式动态分析软件LS-DYNA在嵌入式共固化复合材料阻尼结构面板上模拟低速撞击。为了说明建模和计算方法的有效性,将仿真结果与实验数据进行比较。结果表明,嵌入式共固化复合材料阻尼结构的抗冲击性远远多于复合面板,而不阻尼材料。

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