ADVANCEMENTS IN HIGH FREQUENCY, HIGH RESOLUTION ACOUSTIC MICRO IMAGING FOR THIN SILICON APPLICATIONS

摘要

This paper builds upon work first done in a joint project with Intel [1] on high frequency studies of buried silicon interfaces. That paper reported a study on experimentally determined resolution limits for a series of 230 MHz transducers of different focal lengths using specially designed resolution test targets. This paper takes the information learned from the previous study on test targets and applies it to "real world" applications. In addition further developments on higher frequency transducers to increase resolution needed for these applications will be presented.