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Recently updated FIDES 2009 reliability prediction standard compared to FIDES 2004 and others for realistic failure rates of electronic parts required for quantitative Safety Analysis

机译:最近更新了FIDE 2009可靠性预测标准与FIDE 2004和其他用于定量安全性分析所需的电子部件的现实故障率相比

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The reliability prediction standard FIDES, originated and maintained by the French industry, has been updated by Issue 2009 becoming the most modern standard available. This updated issue is compared to the predecessor FIDES 2004 to reveal the reliability performance of modern complex digital electronic parts being operated in severe use environments. The result is that for those complex digital parts (e. g. FPGAs in 130 nm technology) reliability is still increasing between beginning and end of the current decade. Generally the trend is still increasing reliability for all kinds of electronic parts. Exceptions can be traced to modifications in FIDES 2009 models. Comparison to standards MIL-HDBK-217FN2 (mod.), SN29500, 217plus is updated accordingly.
机译:由法国工业的可靠性预测标准FIDE,起源于法国工业维护,已通过2009年成为最现代化的标准更新。将更新的问题与2004年前任FIDES 2004进行了比较,以揭示在严重使用环境中运行的现代复杂数字电子零件的可靠性性能。结果是对于那些复杂的数字部分(例如,在130 nm技术中FPGA)的可靠性仍在增加当前十年的开始和结束。通常,趋势仍然增加了各种电子部件的可靠性。可以追溯到FIDE 2009型号的修改。与标准MIL-HDBK-217FN2(MOD。),SN29500,217plus进行比较,相应地更新。

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