Conversion of a High Reliability Exempt Product to Pb-free Lessons Learned - 5 Years Into RoHS - (PPT)

摘要

Halogen free boards assessed in this research had early failures during thermal cycling (220 cycles) due to board interconnect/trace failures. Further laminate reformulation is recommended. Demanding thermal cycling conditions were used for this research. Only one component type reached the 63% failure level for Weibull analysis prior to test vehicle/interconnect failures. TL and LF solder joints held up well under these demanding conditions. Failures in solder joints, not surface finish interface. For the U16 BGA component Weibull analysis, TL had higher reliability for early failures, and LF had higher reliability for wear out failures. Solder joints were robust for vibration testing. Interconnect failures occurred before significant solder joint failures. No single experiment can completely validate overall LF versus TL long term reliability performance. This experiment provides evidence that performance is equivalent, better, worse, or mixed for the various components examined.