Feasibility study of EUVL for high volume production applying an electrical test chip - (PPT)

摘要

We evaluated the feasibility of EUVL to high volume manufacture applying an electrical test chip. Following key technologies are investigated and proved to be just before mass production of 35 nm half pitch (22 nm technology-node). Imaging quality of exposure tool; Mask fabrication; Flare compensation methodology. Big yield gains were obtained by improving resist processes. 70% yield was obtained in 35 nm hp at 1000 mm length. 100% yield was obtained in 35 nm hp in 10 mm length. Yield was obtained in 32 nm half pitch. We, Selete and Toshiba, will collaborate to enhance readiness of EUVL both in 22 nm tech. node and beyond.