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Silver Sintering in Power Electronics: The State of the Art in Material Characterization and Reliability Testing

机译:电力电子设备中的银色烧结:材料表征和可靠性测试中的技术

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Sintered silver is a very promising option in the field of automotive power electronics for die-attach and substrate-attach material as it offers many benefits compared to conventional solders. One main advantage is the higher and therefore better thermal and electrical conductivity, which is necessary due to the usage of SiC and GaN as a basic material for semiconductors. Another one is the higher melting point of sintered silver in comparison to solder, making it possible to use power electronics at higher temperatures. Especially for higher temperatures, it is assumed that this results in an improved reliability. Whereas a lot of information about the behavior of sinter layers is known, e.g., thermal properties, material characterization of mechanical properties are still not understood in detail as the results are highly scattered. A reliable test method has to be developed, and this has to be done for cyclic testing, too, which is essential for determining reliability. As mechanical properties are strongly dependent on process parameters, their influence has to be analyzed as well. For example, the influence of the porosity distribution of a sintered layer in between the semiconductor and the upper side of the DBC on the mechanical properties and their reliability is hardly investigated by now. It can be observed that the porosity varies, and that it often increases from the middle of the plane towards the edges. The influence on the stresses and strains and on reliability has to be determined and if required, improvements have to be developed. In the field of FEM simulation, too, a lot of work has to be done. Therefore, the right input material data, which has to be characterized as already described, is absolutely essential. It is also necessary to implement a material model which describes all of the occurring phenomena like primary and secondary creep. This paper will give an overview on the current status and state of the art of silver sintering, focusing on the issues of material characterization and reliability testing.
机译:烧结银是模具安装和基板上的汽车电力电子设备领域的非常有前途的选择,因为与传统焊料相比,它提供了许多益处。一个主要优点是较高且导致的热和导电率更高,导致的热电导和导电率是必要的,这是必要的,这是必要的,这是必要的,因为使用SiC和GaN作为半导体的基本材料。另一个是与焊料相比烧结银的较高熔点,使得可以在较高温度下使用电力电子器件。特别是对于更高的温度,假设这导致可靠性提高。然而,有关烧结层的行为的许多信息是已知的,例如,当结果高度散射时,仍然没有详细理解机械性能的材料表征。必须开发一种可靠的测试方法,并且也必须进行循环测试,这对于确定可靠性至关重要。由于机械性能强烈依赖于工艺参数,因此也必须分析它们的影响。例如,目前难以研究烧结层在半导体和DBC的上侧的孔径分布对机械性能的影响及其可靠性。可以观察到孔隙率变化,并且它通常从平面的中间朝向边缘增加。必须确定对应力和应力和可靠性的影响,并且如果需要,必须开发改进。在有限元模拟领域,必须做大量的工作。因此,必须表征如已经描述的正确输入材料数据绝对是必需的。还必须实现一种材料模型,该材料模型描述了主要和次要蠕变等所有发生现象。本文将概述关于银色烧结艺术的现状和状态,专注于材料表征和可靠性测试的问题。

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