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Nonvolatile memory properties in ZnO-based thin-film transistors with polymer ferroelectric and thin buffer layer

机译:基于ZnO基薄膜晶体管的非易失性存储器性能,具有聚合物铁电和薄缓冲层

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We report the fabrication of ZnO non-volatile memory thin-film transistors (NVM-TFTs) with thin poly(vinylidene fluoride/trifluoroethylene)[P(VDF-TrFE)] ferroelectric layer and thin Al_2O_3 buffer layers. When our memory TFT has a thin Al_2O_3 layer inserted between P(VDF-TrFE) and ZnO channel: 5 nm, 10 nm and 20 nm Our NVM-TFT operates on glass substrates under low voltage write-erase (WR-ER) pulse of ±20 V with high field effect mobilities of 0.6-1 cm~2/Vs. The device with the Al_2O_3 layer shows much longer retention properties over 10~4 s than the other without buffer. Depending on the thickness of buffer, our NVM-TFT displays maximum memory window of ~20 V and also exhibits WR-ER current ratio of 4×10~2.
机译:我们报道了ZnO非挥发性存储器薄膜晶体管(NVM-TFT)的制造,具有薄的聚(偏二氟乙烯/三氟乙烯)[P(VDF-TRFE)]铁电层和薄Al_2O_3缓冲层。当我们的存储器TFT在P(VDF-TRFE)和ZnO通道之间插入薄的AL_2O_3层时:5nm,10nm和20nm,我们的NVM-TFT在低压写擦(WR-ER)脉冲下的玻璃基板上运行±20 v具有0.6-1cm〜2 / vs的高场效应迁移率。具有AL_2O_3层的器件在没有缓冲器的情况下显示超过10〜4的更长的保留属性。根据缓冲液的厚度,我们的NVM-TFT显示〜20 V的最大内存窗口,也显示出4×10〜2的WR-ER电流比。

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