Front End/Back End: Morphing the Manufacturing Model for Tough Times - (PPT)

摘要

Past: Value Resided In Chip and Design. Today: System Architecture and Integration Determining Value, but there are limits…. - A faster method of design AND verification needed - A faster AND much more flexible wafer fabrication process required. And both at lower cost. Future: Packaging Technology Adds More Value to System As Time-to-Market Compresses and Silicon Becomes Commoditized.