MEASUREMENTS FOR MECHANICAL RELIABILITY OF THIN FILMS

摘要

This paper reviews techniques for measurement of basic mechanical properties of thin films. Emphasis is placed on the adaptations needed to prepare, handle, and characterize thin films, and on adaptations of fracture mechanics for adhesion strength. The paper also describes a recent development, the use of electrical current as a controlled means of applying thermo-mechanical stresses to electrical conductors to characterize their fatigue behavior.