Briefing Agenda and 2009 Program Overview - (PPT)

摘要

The IC makers committed to the 450 mm transition have significant differences in products, business models, and technologies; But they have agreed on nominal performance targets, common timeline, and strategy for test wafer generation, equipment demonstrations, and first-generation production equipment; - 450 mm test wafer generation capabilities in 2009, with 300 mm-equivalent capability; - Equipment demonstrations for process and metrology equipment in 2010 to 2012, with 32 nm [1] capability; - Production-ready equipment capable of supporting IC maker pilot lines in 2012+ with technology scalable to 22 nm [1] and beyond.