INTERCONNECTION IN 3-D FOR SMART SENSORS/ABANDONED SENSORS

摘要

The fantastic development of the components interconnection allows to imagine of around a few mm3, which opens new perspectives for industrial applications. Since the use of hybrid modules, then Multichip Modules which were identical to the previous ones but named differently, the coming of the interconnection in 3-D allowed to divide both the volume and weight of a module by a factor comprised between 25 and more than 100. We can distinguish several technologies among the technologies used for the 3-D interconnection, (table figure 1).