Recently researches for the technology to restrain the emission of PFCs(Perfluorocarbons) gas which is known to have much influence on the global warming has been conducted by many research institutions concerning about the environment of manufacturing semiconductor and LCD process and safety issue. NF_3, CF_4, SF_6, CHF_3 etc. are the PFCs gases emitted during the process of manufacturing semiconductor. These gases are as much stable as it takes thousands to tens of thousands of years for the materials to be decomposed in natural condition. Although the emitted volume is insignificant, those gas emissions will be restricted in the future by international convention because the global warming index by these gases is much higher than by Carbon Dioxide. Developing substitutive materials and enhancing the manufacturing process in the way of reducing the use of PFCs are the major methods to reduce the emission of PFCs gas. Recently the study of converting the PFCs to low Global Warming Potential(GWP) materials by decomposing has actively conducted and the study about PFCs decomposition reaction using atmospheric pressure plasma which device and operation costs are low and the secondary contamination is rare is in progress as well. So pyrolysis technology using atmosphere pressure plasma has many advantages over against combustion and catalyst is demanded.
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